Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Lead, Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DO-214AA, SMB |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Published | 2011 |
JESD-609 Code | e3 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Finish | Tin (Sn) |
Max Operating Temperature | 125°C |
Min Operating Temperature | -55°C |
Additional Feature | LOW LEAKAGE CURRENT |
HTS Code | 8541.10.00.80 |
Terminal Position | DUAL |
Terminal Form | C BEND |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | not_compliant |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | CD214B |
Pin Count | 2 |
Qualification Status | Not Qualified |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 5μA @ 50V |
Voltage - Forward (Vf) (Max) @ If | 920mV @ 1A |
Forward Current | 2A |
Operating Temperature - Junction | -55°C~125°C |
Max Surge Current | 50A |
Output Current-Max | 2A |
Application | GENERAL PURPOSE |
Forward Voltage | 920mV |
Max Reverse Voltage (DC) | 50V |
Average Rectified Current | 2A |
Number of Phases | 1 |
Peak Reverse Current | 5μA |
Max Repetitive Reverse Voltage (Vrrm) | 50V |
Capacitance @ Vr, F | 200pF @ 4V 1MHz |
Peak Non-Repetitive Surge Current | 50A |
Reverse Voltage | 50V |
RoHS Status | ROHS3 Compliant |