Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DO-214AB, SMC |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Published | 2014 |
JESD-609 Code | e3 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Max Operating Temperature | 175°C |
Min Operating Temperature | -65°C |
HTS Code | 8541.10.00.80 |
Terminal Position | DUAL |
Terminal Form | C BEND |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | not_compliant |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | CD214C |
Pin Count | 2 |
Qualification Status | Not Qualified |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 10μA @ 200V |
Voltage - Forward (Vf) (Max) @ If | 1.15V @ 3A |
Forward Current | 3A |
Operating Temperature - Junction | -65°C~175°C |
Max Surge Current | 100A |
Output Current-Max | 3A |
Application | GENERAL PURPOSE |
Forward Voltage | 1.15V |
Max Reverse Voltage (DC) | 200V |
Average Rectified Current | 3A |
Number of Phases | 1 |
Peak Reverse Current | 10μA |
Max Repetitive Reverse Voltage (Vrrm) | 200V |
Capacitance @ Vr, F | 40pF @ 4V 1MHz |
Peak Non-Repetitive Surge Current | 100A |
Reverse Voltage | 200V |
RoHS Status | ROHS3 Compliant |