Parameters |
Mounting Type |
Surface Mount |
Package / Case |
16-SOIC (0.209, 5.30mm Width) |
Surface Mount |
YES |
Operating Temperature |
-55°C~125°C TA |
Packaging |
Tube |
Series |
4000B |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
16 |
Terminal Finish |
MATTE TIN |
Additional Feature |
CMOS-TTL LEVEL TRANSLATOR |
Technology |
CMOS |
Voltage - Supply |
3V~15V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Number of Functions |
6 |
Supply Voltage |
5V |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Pin Count |
16 |
Qualification Status |
COMMERCIAL |
Output Type |
Push-Pull |
Number of Elements |
6 |
Supply Voltage-Min (Vsup) |
3V |
Number of Inputs |
1 |
Current - Output High, Low |
12mA 40mA |
Logic Type |
Buffer, Non-Inverting |
Number of Bits per Element |
1 |
Width |
5.3mm |
RoHS Status |
ROHS3 Compliant |
CD4050BCSJ Overview
Logical driver uses a neat 16-SOIC (0.209, 5.30mm Width) package. Tube external packaging. Available in Surface Mount. Voltage buffer adopts Buffer, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 3V~15V. Qualified to operate within -55°C~125°C TA. The high and low logic state output current of logical driver is 12mA 40mA. Logical driver can deal with Push-Pull output (s). All of the 6 elements are put into use. Digital buffer is one of the 4000B series devices. 16 terminations with different functions. Buffer IC reuqires a supply voltage of 5V. 16 pins are set with the electric part. The bus transceiver employs 1 bits for each element. To supply the device, a minimum voltage of 3V is a must. Logical driver features CMOS-TTL LEVEL TRANSLATOR to better serve the need. Digital buffer is characterized to have 1 inputs.
CD4050BCSJ Features
CMOS-TTL LEVEL TRANSLATOR
CD4050BCSJ Applications
There are a lot of Rochester Electronics, LLC CD4050BCSJ Buffers & Transceivers applications.
- Automation systems
- Digital systems
- Optical sub-assembly (OSA)
- Structural bonding
- Shortwave receiver
- Wireless multimedia center in smart home
- Interconnection between switches and computers
- Changeing the frequency from IF to RF
- Televisions
- Cell phones