Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Chassis Mount |
Package / Case | Module |
Surface Mount | NO |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 2011 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Additional Feature | UL RECOGNIZED |
HTS Code | 8541.10.00.80 |
Terminal Position | UPPER |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-XUFM-X3 |
Operating Temperature (Max) | 150°C |
Operating Temperature (Min) | -40°C |
Number of Elements | 2 |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 12mA @ 1800V |
Case Connection | ISOLATED |
Forward Current | 160A |
Application | GENERAL PURPOSE |
Voltage - DC Reverse (Vr) (Max) | 1800V |
Forward Voltage | 1.56V |
Max Reverse Voltage (DC) | 1.8kV |
Average Rectified Current | 160A |
Number of Phases | 1 |
Max Repetitive Reverse Voltage (Vrrm) | 1.8kV |
Diode Configuration | 1 Pair Series Connection |
Reverse Current-Max | 12000μA |
REACH SVHC | Unknown |
RoHS Status | RoHS Compliant |