Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | TO-277, 3-PowerDFN |
Number of Pins | 3 |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Published | 2013 |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Terminal Finish | PURE TIN |
Max Operating Temperature | 150°C |
Min Operating Temperature | -55°C |
Additional Feature | LOW POWER LOSS |
HTS Code | 8541.10.00.80 |
Terminal Position | DUAL |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Schottky |
Current - Reverse Leakage @ Vr | 100μA @ 200V |
Voltage - Forward (Vf) (Max) @ If | 930mV @ 20A |
Case Connection | CATHODE |
Forward Current | 20A |
Operating Temperature - Junction | -55°C~150°C |
Application | EFFICIENCY |
Forward Voltage | 930mV |
Max Reverse Voltage (DC) | 200V |
Average Rectified Current | 20A |
Number of Phases | 1 |
Peak Reverse Current | 100μA |
Max Repetitive Reverse Voltage (Vrrm) | 200V |
Max Forward Surge Current (Ifsm) | 280A |
RoHS Status | ROHS3 Compliant |