CDLL5309
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Mount | Surface Mount |
| Diode Element Material | SILICON |
| Published | 1999 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Active |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| Terminal Finish | TIN LEAD |
| Additional Feature | METALLURGICALLY BONDED |
| HTS Code | 8541.10.00.70 |
| Technology | FIELD EFFECT |
| Terminal Position | END |
| Terminal Form | WRAP AROUND |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 2 |
| JESD-30 Code | O-LELF-R2 |
| Qualification Status | Not Qualified |
| Number of Elements | 1 |
| Max Supply Voltage | 100V |
| Power Dissipation-Max | 0.5W |
| Element Configuration | Single |
| Diode Type | CURRENT REGULATOR DIODE |
| Case Connection | ISOLATED |
| JEDEC-95 Code | DO-213AB |
| Regulation Current-Nom (Ireg) | 3mA |
| Limiting Voltage-Max | 2.25V |
| RoHS Status | Non-RoHS Compliant |
See Relate Datesheet
