Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DO-213AB, MELF |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 1997 |
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Finish | TIN LEAD |
Max Operating Temperature | 125°C |
Min Operating Temperature | -55°C |
Additional Feature | METALLURGICALLY BONDED |
HTS Code | 8541.10.00.80 |
Terminal Position | END |
Terminal Form | WRAP AROUND |
Pin Count | 2 |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Schottky |
Current - Reverse Leakage @ Vr | 100μA @ 20V |
Voltage - Forward (Vf) (Max) @ If | 600mV @ 1A |
Case Connection | ISOLATED |
Forward Current | 1A |
Operating Temperature - Junction | -55°C~125°C |
Output Current-Max | 1A |
Forward Voltage | 900mV |
Max Reverse Voltage (DC) | 20V |
Average Rectified Current | 1A |
Peak Reverse Current | 100μA |
Max Repetitive Reverse Voltage (Vrrm) | 20V |
Natural Thermal Resistance | 40 °C/W |
Radiation Hardening | No |
RoHS Status | Non-RoHS Compliant |