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CE201210-R18J

Ind Chip Multi-Layer 180nH 5% 50MHz 23Q-Factor Ceramic 300mA 0805 T/R


  • Manufacturer: Bourns Inc.
  • Nocochips NO: 103-CE201210-R18J
  • Package: 0805 (2012 Metric)
  • Datasheet: PDF
  • Stock: 508
  • Description: Ind Chip Multi-Layer 180nH 5% 50MHz 23Q-Factor Ceramic 300mA 0805 T/R(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 0805 (2012 Metric)
Terminal Shape WRAPAROUND
Weight 5.499807mg
Material - Core Ceramic
Shape/Size Description RECTANGULAR PACKAGE
Operating Temperature -55°C~125°C
Packaging Tape & Reel (TR)
Published 2012
Series CE201210
Size / Dimension 0.079Lx0.049W 2.00mmx1.25mm
Tolerance ±5%
JESD-609 Code e2
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Termination SMD/SMT
ECCN Code EAR99
Type Multilayer
Terminal Finish Silver/Nickel/Tin (Ag/Ni/Sn)
HTS Code 8504.50.80.00
Packing Method TR, 7 Inch
Shielding NO
Number of Functions 1
Depth 1.45mm
Construction Rectangular
Current Rating 300mA
Military Standard Not
Case Code (Metric) 2012
Case Code (Imperial) 0805
Inductance 180nH
Test Frequency 50MHz
DC Resistance (DCR) 1.1Ohm Max
Current 300mA
Max DC Current 300mA
Frequency - Self Resonant 400MHz
Inductor Application RF INDUCTOR
Terminal Placement DUAL ENDED
Q @ Freq 23 @ 100MHz
DC Current 300mA
Height 1mm
Height Seated (Max) 0.041 1.03mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
See Relate Datesheet

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