Parameters |
Terminal Shape |
WRAPAROUND |
Number of Pins |
112 |
Operating Temperature |
-55°C~105°C |
Packaging |
Tape & Reel (TR) |
Published |
2012 |
Series |
CGB |
Size / Dimension |
0.079Lx0.049W 2.00mmx1.25mm |
Tolerance |
±20% |
JESD-609 Code |
e3 |
Feature |
Low Profile |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
Termination |
SMD/SMT |
ECCN Code |
EAR99 |
Temperature Coefficient |
X6S |
Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier |
Composition |
Ceramic |
Applications |
General Purpose |
HTS Code |
8532.24.00.20 |
Capacitance |
2.2μF |
Voltage - Rated DC |
16V |
Frequency |
48MHz |
Case Code (Metric) |
2012 |
Case Code (Imperial) |
0805 |
Temperature Characteristics Code |
X6S |
Multilayer |
Yes |
Interface |
EBI/EMI, I2C, IrDA, SPI, UART, USART, USB |
Memory Size |
128kB |
Oscillator Type |
Internal |
Number of I/O |
93 |
Memory Type |
FLASH |
Peripherals |
Brown-out Detect/Reset, DMA, POR, PWM, WDT |
Core Architecture |
ARM |
Height |
550μm |
Thickness (Max) |
0.022 0.55mm |
RoHS Status |
ROHS3 Compliant |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount, MLCC |
Package / Case |
0805 (2012 Metric) |
Surface Mount |
YES |
CGB4B1X6S1C225M055AC Overview
For this device, the size/dimension of the program is 0.079Lx0.049W 2.00mmx1.25mm.As a general rule, temperature coefficient of resistance is simply the change in electrical resistance of a substance per degree change in temperature, and its value is X6S.Powered by voltage of 16V, it can be operated with a voltage of rated DC.
CGB4B1X6S1C225M055AC Features
a size/dimension of 0.079Lx0.049W 2.00mmx1.25mm
with X6S being the highest temperature coefficient
with the voltage - Rated DC of 16V
CGB4B1X6S1C225M055AC Applications
There are a lot of TDK Corporation CGB4B1X6S1C225M055AC applications of ceramic capacitors.
- Servers, PCs, tablets
- General electronic equipment
- Mobile devices
- Power supply circuit