Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Package / Case | 2-VDFN Exposed Pad |
Number of Pins | 3 |
Diode Element Material | SILICON |
Operating Temperature | 175°C TJ |
Packaging | Cut Tape (CT) |
Published | 2005 |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
Termination | SMD/SMT |
ECCN Code | EAR99 |
Terminal Finish | Tin (Sn) |
HTS Code | 8541.10.00.80 |
Technology | POSITIVE-INTRINSIC-NEGATIVE |
Terminal Position | DUAL |
Peak Reflow Temperature (Cel) | 260 |
Base Part Number | CLA4603-085 |
Pin Count | 3 |
JESD-30 Code | S-PDSO-N2 |
Number of Elements | 1 |
Max Current Rating | 1.5A |
Power Dissipation-Max | 2W |
Element Configuration | Common Anode |
Diode Type | PIN - Single |
Power Dissipation | 30W |
Case Connection | CATHODE |
Forward Current | 1.5A |
Application | LIMITER |
Capacitance @ Vr, F | 0.4pF @ 6V 1MHz |
Reverse Voltage | 45V |
Max Junction Temperature (Tj) | 175°C |
Breakdown Voltage-Min | 20V |
Reverse Voltage (DC) | 45V |
Frequency Band | HIGH FREQUENCY TO C B |
Resistance @ If, F | 2Ohm @ 10mA 100MHz |
Diode Capacitance-Max | 0.4pF |
Minority Carrier Lifetime-Nom | 0.01 μs |
Diode Forward Resistance-Max | 2Ohm |
Height | 1mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |