Parameters | |
---|---|
Lifecycle Status | ACTIVE (Last Updated: 2 days ago) |
Contact Plating | Copper, Silver, Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 6-UFBGA, DSBGA |
Number of Pins | 6 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Series | NexFET™ |
JESD-609 Code | e1 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Additional Feature | ULTRA LOW RESISTANCE |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Base Part Number | CSD13306 |
Number of Elements | 1 |
Number of Channels | 1 |
Power Dissipation-Max | 1.9W Ta |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 1.9W |
Turn On Delay Time | 7 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 10.2m Ω @ 1.5A, 4.5V |
Vgs(th) (Max) @ Id | 1.3V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 1370pF @ 6V |
Current - Continuous Drain (Id) @ 25°C | 3.5A Ta |
Gate Charge (Qg) (Max) @ Vgs | 11.2nC @ 4.5V |
Rise Time | 11ns |
Drain to Source Voltage (Vdss) | 12V |
Drive Voltage (Max Rds On,Min Rds On) | 2.5V 4.5V |
Vgs (Max) | ±10V |
Fall Time (Typ) | 8 ns |
Turn-Off Delay Time | 20 ns |
Continuous Drain Current (ID) | 3.5A |
Threshold Voltage | 1V |
Gate to Source Voltage (Vgs) | 10V |
Max Junction Temperature (Tj) | 150°C |
Feedback Cap-Max (Crss) | 294 pF |
Height | 1mm |
Length | 1.5mm |
Width | 1.8mm |
Thickness | 2mm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |