Parameters | |
---|---|
Lifecycle Status | NRND (Last Updated: 4 weeks ago) |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-PowerTDFN |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Series | NexFET™ |
JESD-609 Code | e3 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 5 |
ECCN Code | EAR99 |
Additional Feature | AVALANCHE RATED |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | CSD16407 |
Pin Count | 8 |
Qualification Status | Not Qualified |
Number of Elements | 1 |
Power Dissipation-Max | 3.1W Ta |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 3.1W |
Case Connection | DRAIN |
Turn On Delay Time | 11.9 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 2.4m Ω @ 25A, 10V |
Vgs(th) (Max) @ Id | 1.9V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 2660pF @ 12.5V |
Current - Continuous Drain (Id) @ 25°C | 31A Ta 100A Tc |
Gate Charge (Qg) (Max) @ Vgs | 18nC @ 4.5V |
Rise Time | 18.4ns |
Drain to Source Voltage (Vdss) | 25V |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | +16V, -12V |
Fall Time (Typ) | 9 ns |
Turn-Off Delay Time | 16 ns |
Continuous Drain Current (ID) | 100A |
Gate to Source Voltage (Vgs) | 16V |
Drain-source On Resistance-Max | 0.0033Ohm |
Pulsed Drain Current-Max (IDM) | 200A |
DS Breakdown Voltage-Min | 25V |
Nominal Vgs | 1.6 V |
Height | 1.05mm |
Length | 5mm |
Width | 6mm |
Thickness | 1mm |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Contains Lead |