Parameters | |
---|---|
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Number of Channels | 1 |
Power Dissipation-Max | 2.6W Ta |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2.6W |
Case Connection | DRAIN |
Turn On Delay Time | 8 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 9m Ω @ 11A, 10V |
Vgs(th) (Max) @ Id | 2.1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 1370pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 12A Tc |
Gate Charge (Qg) (Max) @ Vgs | 7.8nC @ 4.5V |
Rise Time | 24ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 3.4 ns |
Turn-Off Delay Time | 12 ns |
Factory Lead Time | 1 Week |
Continuous Drain Current (ID) | 12A |
Lifecycle Status | ACTIVE (Last Updated: 4 days ago) |
Threshold Voltage | 1.6V |
Contact Plating | Tin |
Gate to Source Voltage (Vgs) | 20V |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Drain to Source Breakdown Voltage | 30V |
Package / Case | 8-PowerVDFN |
Max Junction Temperature (Tj) | 150°C |
Number of Pins | 8 |
Nominal Vgs | 1.6 V |
Transistor Element Material | SILICON |
Height | 900μm |
Operating Temperature | -55°C~150°C TJ |
Length | 3.3mm |
Packaging | Tape & Reel (TR) |
Width | 3.3mm |
Thickness | 800μm |
Series | NexFET™ |
Radiation Hardening | No |
JESD-609 Code | e3 |
REACH SVHC | Unknown |
Pbfree Code | yes |
RoHS Status | ROHS3 Compliant |
Part Status | Active |
Lead Free | Lead Free |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 5 |
ECCN Code | EAR99 |
Additional Feature | AVALANCHE RATED |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | FLAT |
Peak Reflow Temperature (Cel) | 260 |
Base Part Number | CSD17551 |