Parameters | |
---|---|
Number of Elements | 1 |
Power Dissipation-Max | 375W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Case Connection | DRAIN |
Turn On Delay Time | 8 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Factory Lead Time | 1 Week |
Rds On (Max) @ Id, Vgs | 1.6m Ω @ 100A, 10V |
Vgs(th) (Max) @ Id | 2.2V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 11430pF @ 30V |
Lifecycle Status | ACTIVE (Last Updated: 2 days ago) |
Current - Continuous Drain (Id) @ 25°C | 200A Ta |
Gate Charge (Qg) (Max) @ Vgs | 108nC @ 10V |
Rise Time | 17ns |
Drain to Source Voltage (Vdss) | 60V |
Contact Plating | Copper, Tin |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 12 ns |
Turn-Off Delay Time | 23 ns |
Mount | Through Hole |
Continuous Drain Current (ID) | 200A |
Gate to Source Voltage (Vgs) | 20V |
Drain-source On Resistance-Max | 0.0022Ohm |
Pulsed Drain Current-Max (IDM) | 400A |
Mounting Type | Through Hole |
DS Breakdown Voltage-Min | 60V |
Avalanche Energy Rating (Eas) | 819 mJ |
Feedback Cap-Max (Crss) | 51 pF |
Height | 4.7mm |
Length | 10.16mm |
Package / Case | TO-220-3 |
Width | 8.7mm |
Thickness | 4.58mm |
RoHS Status | ROHS3 Compliant |
Lead Free | Contains Lead |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tube |
Series | NexFET™ |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) |
Additional Feature | AVALANCHE RATED |
Technology | MOSFET (Metal Oxide) |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | not_compliant |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | CSD18536 |
Pin Count | 3 |