Parameters | |
---|---|
Avalanche Energy Rating (Eas) | 274 mJ |
Max Junction Temperature (Tj) | 150°C |
Height | 1.05mm |
Length | 5mm |
Width | 6mm |
Thickness | 950μm |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Contains Lead |
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 1 day ago) |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-PowerTDFN |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Series | NexFET™ |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 5 |
ECCN Code | EAR99 |
Additional Feature | AVALANCHE RATED |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | 260 |
Reach Compliance Code | not_compliant |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | CSD19532 |
Number of Elements | 1 |
Number of Channels | 1 |
Power Dissipation-Max | 3.1W Ta 195W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 3.1W |
Case Connection | DRAIN |
Turn On Delay Time | 7 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 4.9m Ω @ 17A, 10V |
Vgs(th) (Max) @ Id | 3.2V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 4810pF @ 50V |
Current - Continuous Drain (Id) @ 25°C | 100A Ta |
Gate Charge (Qg) (Max) @ Vgs | 62nC @ 10V |
Rise Time | 6ns |
Drive Voltage (Max Rds On,Min Rds On) | 6V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 6 ns |
Turn-Off Delay Time | 22 ns |
Continuous Drain Current (ID) | 100A |
Threshold Voltage | 2.6V |
Gate to Source Voltage (Vgs) | 20V |
Drain-source On Resistance-Max | 0.0057Ohm |
Drain to Source Breakdown Voltage | 100V |
Pulsed Drain Current-Max (IDM) | 400A |