Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 5 days ago) |
Contact Plating | Copper, Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-PowerVDFN |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Series | NexFET™ |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 5 |
Resistance | 12.1mOhm |
Terminal Finish | Matte Tin (Sn) |
Additional Feature | AVALANCHE RATED |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | NO LEAD |
Reach Compliance Code | not_compliant |
Base Part Number | CSD19537 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 2.8W Ta 83W Tc |
Operating Mode | ENHANCEMENT MODE |
Case Connection | DRAIN |
Turn On Delay Time | 5 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 14.5m Ω @ 10A, 10V |
Vgs(th) (Max) @ Id | 3.6V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 1680pF @ 50V |
Current - Continuous Drain (Id) @ 25°C | 50A Ta |
Gate Charge (Qg) (Max) @ Vgs | 21nC @ 10V |
Rise Time | 3ns |
Drain to Source Voltage (Vdss) | 100V |
Drive Voltage (Max Rds On,Min Rds On) | 6V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 3 ns |
Turn-Off Delay Time | 10 ns |
Continuous Drain Current (ID) | 50A |
Threshold Voltage | 3V |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 9.7A |
Pulsed Drain Current-Max (IDM) | 219A |
DS Breakdown Voltage-Min | 100V |
Avalanche Energy Rating (Eas) | 55 mJ |
Feedback Cap-Max (Crss) | 17.3 pF |
Length | 3.3mm |
Width | 3.3mm |
Thickness | 1mm |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Contains Lead |