Parameters | |
---|---|
Threshold Voltage | 600mV |
Gate to Source Voltage (Vgs) | -6V |
Drain to Source Breakdown Voltage | 12V |
Dual Supply Voltage | 12V |
Nominal Vgs | 600 mV |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Contains Lead |
Contact Plating | Copper, Silver, Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 4-UFBGA, DSBGA |
Number of Pins | 4 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Series | NexFET™ |
JESD-609 Code | e1 |
Pbfree Code | no |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 4 |
Termination | SMD/SMT |
ECCN Code | EAR99 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Subcategory | Other Transistors |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Base Part Number | CSD23201 |
Pin Count | 4 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE AND RESISTOR |
Power Dissipation-Max | 1W Ta |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 1W |
Turn On Delay Time | 24 ns |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 82m Ω @ 500mA, 4.5V |
Vgs(th) (Max) @ Id | 1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 325pF @ 6V |
Current - Continuous Drain (Id) @ 25°C | 2.2A Tc |
Gate Charge (Qg) (Max) @ Vgs | 2.4nC @ 4.5V |
Rise Time | 19ns |
Drive Voltage (Max Rds On,Min Rds On) | 1.5V 4.5V |
Fall Time (Typ) | 29 ns |
Turn-Off Delay Time | 68 ns |
Continuous Drain Current (ID) | 2.2A |