Parameters | |
---|---|
Current - Continuous Drain (Id) @ 25°C | 3A Ta |
Gate Charge (Qg) (Max) @ Vgs | 6.3nC @ 4.5V |
Rise Time | 12ns |
Drain to Source Voltage (Vdss) | 8V |
Drive Voltage (Max Rds On,Min Rds On) | 1.8V 4.5V |
Fall Time (Typ) | 27 ns |
Turn-Off Delay Time | 58 ns |
Continuous Drain Current (ID) | 3A |
Threshold Voltage | -800mV |
Gate to Source Voltage (Vgs) | -6V |
Drain Current-Max (Abs) (ID) | 3A |
Drain-source On Resistance-Max | 0.053Ohm |
Drain to Source Breakdown Voltage | -8V |
Feedback Cap-Max (Crss) | 172 pF |
Height | 1mm |
Length | 1.5mm |
Width | 1.8mm |
Thickness | 2mm |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 5 days ago) |
Contact Plating | Copper, Silver, Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 6-UFBGA, DSBGA |
Number of Pins | 6 |
Weight | 1.700971mg |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Series | NexFET™ |
JESD-609 Code | e1 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Base Part Number | CSD23203 |
Number of Elements | 1 |
Power Dissipation-Max | 750mW Ta |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Turn On Delay Time | 14 ns |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 19.4m Ω @ 1.5A, 4.5V |
Vgs(th) (Max) @ Id | 1.1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 914pF @ 4V |