Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 3 days ago) |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 3-XFDFN |
Number of Pins | 3 |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Series | NexFET™ |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | CSD23381 |
Number of Channels | 1 |
Power Dissipation-Max | 500mW Ta |
Element Configuration | Single |
Operating Mode | -0.95 |
Power Dissipation | 500mW |
Turn On Delay Time | 4.5 ns |
FET Type | P-Channel |
Rds On (Max) @ Id, Vgs | 175m Ω @ 500mA, 4.5V |
Vgs(th) (Max) @ Id | 1.2V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 236pF @ 6V |
Current - Continuous Drain (Id) @ 25°C | 2.3A Ta |
Gate Charge (Qg) (Max) @ Vgs | 1.14nC @ 4.5V |
Rise Time | 3.9ns |
Drain to Source Voltage (Vdss) | 12V |
Drive Voltage (Max Rds On,Min Rds On) | 1.8V 4.5V |
Fall Time (Typ) | 7 ns |
Turn-Off Delay Time | 18 ns |
Continuous Drain Current (ID) | 2.3A |
Gate to Source Voltage (Vgs) | -8V |
Drain to Source Breakdown Voltage | -12V |
Height | 350μm |
Length | 1.035mm |
Width | 635μm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |