Parameters | |
---|---|
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-PowerTDFN |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Series | NexFET™ |
JESD-609 Code | e3 |
Pbfree Code | no |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 5 |
Termination | SMD/SMT |
ECCN Code | EAR99 |
Additional Feature | AVALANCHE RATED |
Subcategory | Other Transistors |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Peak Reflow Temperature (Cel) | 260 |
Base Part Number | CSD25401 |
Pin Count | 8 |
JESD-30 Code | R-PDSO-N5 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 2.8W Ta |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2.8W |
Case Connection | SOURCE |
Turn On Delay Time | 8.1 ns |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 11.7m Ω @ 10A, 4.5V |
Vgs(th) (Max) @ Id | 1.2V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 1400pF @ 10V |
Current - Continuous Drain (Id) @ 25°C | 14A Ta 60A Tc |
Gate Charge (Qg) (Max) @ Vgs | 12.3nC @ 4.5V |
Rise Time | 3.9ns |
Drive Voltage (Max Rds On,Min Rds On) | 2.5V 4.5V |
Vgs (Max) | ±12V |
Fall Time (Typ) | 12.6 ns |
Turn-Off Delay Time | 13.5 ns |
Continuous Drain Current (ID) | 14A |
Threshold Voltage | 850mV |
Gate to Source Voltage (Vgs) | 12V |
Drain Current-Max (Abs) (ID) | 60A |
Drain to Source Breakdown Voltage | -20V |
Dual Supply Voltage | 20V |
Nominal Vgs | 850 mV |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Contains Lead |