Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 5 days ago) |
Mounting Type | Surface Mount |
Package / Case | 12-PowerTFDFN |
Surface Mount | YES |
Number of Pins | 12 |
Operating Temperature | -40°C~125°C TJ |
Packaging | Tape & Reel (TR) |
Series | NexFET™ |
JESD-609 Code | e3 |
Feature | Bootstrap Circuit |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 2 (1 Year) |
Number of Terminations | 12 |
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) |
Applications | Synchronous Buck Converters |
Additional Feature | OUTPUT IN ADJUSTABLE MODE IS UPTO 5.5V |
Technology | Power MOSFET |
Voltage - Supply | 4.5V~5.5V |
Terminal Position | DUAL |
Terminal Form | NO LEAD |
Number of Functions | 1 |
Base Part Number | CSD95490 |
Input Voltage-Nom | 12V |
Interface | PWM |
Analog IC - Other Type | SWITCHING REGULATOR |
Output Configuration | Half Bridge (3) |
Input Voltage (Min) | 4.5V |
Input Voltage (Max) | 16V |
Control Technique | PULSE WIDTH MODULATION |
Voltage - Load | 4.5V~16V |
Current - Output / Channel | 75A |
Fault Protection | Shoot-Through |
Current - Peak Output | 105A |
Load Type | Inductive, Capacitive |
Length | 6mm |
Width | 5mm |
Thickness | 980μm |
RoHS Status | ROHS3 Compliant |
The CSD95490Q5MC NexFET? power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. The driver IC and power MOSFETs are combined in this product to accomplish the power stage switching function. In a compact 5-mm by 6-mm outline package, this combination produces high-current, high-efficiency, and high-speed switching capability. To simplify system design and enhance accuracy, it also includes accurate current sensing and temperature sensor functionality. In addition, the PCB footprint has been streamlined to aid minimize design time and making the overall system design easier to complete.
Halogen Free
Fault Monitoring
Tri-State PWM Input
Diode Emulation Function
Integrated Bootstrap Switch
Analog Temperature Output
Ultra-Low-Inductance Package
System Optimized PCB Footprint
Over 95% System Efficiency at 30 A
Thermally Enhanced Topside Cooling
3.3-V and 5-V PWM Signal Compatible
High-Frequency Operation (up to 1.25 MHz)
High-Density QFN 5-mm × 6-mm Footprint
RoHS Compliant – Lead-Free Terminal Plating
75-A Continuous Operating Current Capability
Optimized Dead Time for Shoot-Through Protection
Temperature Compensated Bi-Directional Current Sense
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