Parameters |
Mounting Type |
Surface Mount |
Package / Case |
64-LQFP |
Surface Mount |
YES |
Operating Temperature |
0°C~70°C |
Packaging |
Tray |
Series |
CY7C |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
64 |
Additional Feature |
RETRANSMIT |
Technology |
CMOS |
Voltage - Supply |
4.5V~5.5V |
Terminal Position |
QUAD |
Terminal Form |
GULL WING |
Supply Voltage |
5V |
Terminal Pitch |
0.5mm |
JESD-30 Code |
S-PQFP-G64 |
Function |
Synchronous |
Current - Supply (Max) |
45mA |
Qualification Status |
COMMERCIAL |
Supply Voltage-Max (Vsup) |
5.5V |
Supply Voltage-Min (Vsup) |
4.5V |
Memory Size |
72K 4K x 18 |
Access Time |
8ns |
Data Rate |
100MHz |
Organization |
4KX18 |
Memory Width |
18 |
Memory Density |
73728 bit |
Parallel/Serial |
PARALLEL |
Bus Directional |
Uni-Directional |
FWFT Support |
No |
Programmable Flags Support |
Yes |
Output Enable |
YES |
Expansion Type |
Depth, Width |
Cycle Time |
10 ns |
Height Seated (Max) |
1.6mm |
Length |
10mm |
Width |
10mm |
RoHS Status |
ROHS3 Compliant |
CY7C4245-10ASXC Overview
This package is included in 64-LQFP .This FIFO memory chip is packaged as a Tray .There is a memory of 72K 4K x 18 on the FIFO chip that can be used to store applications and data.Keeping the temperature at 0°C~70°C will ensure reliable operation.A mounting type of Surface Mount is associated with the FIFO memory.A voltage supply of 4.5V~5.5V is needed to operate it.The CY7C series comprises this memory logic.A FIFO's maximum operating supply current of 45mA is available.When the supply voltage is 5V there is the possibility of high efficiency.FIFO means contains 64 terminations.With the help of this FIFO memory, RETRANSMIT can also be generated.FIFO memory IC's maximum supply voltage is set to 5.5V .A voltage above 4.5V is necessary for normal operation.
CY7C4245-10ASXC Features
72K 4K x 18 memory size
CY7C series
CY7C4245-10ASXC Applications
There are a lot of Rochester Electronics, LLC CY7C4245-10ASXC FIFOs Memory applications.
- Cameras
- Data-acquisition systems
- General Data Collection Applications at Extreme High-Temperatures
- Portable Information Devices
- Extended product-change notification
- Wireless
- High-speed disk
- Queues for communication systems
- Signal processing
- Extended product life cycle