Parameters |
Mounting Type |
Surface Mount |
Package / Case |
209-BGA |
Supplier Device Package |
209-FBGA (14x22) |
Operating Temperature |
-40°C~85°C |
Packaging |
Tray |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Voltage - Supply |
1.7V~1.9V |
Function |
Synchronous |
Memory Size |
72M 2M x 36 |
Access Time |
10ns |
Data Rate |
133MHz |
Bus Directional |
Uni-Directional |
Retransmit Capability |
Yes |
FWFT Support |
No |
Programmable Flags Support |
Yes |
Expansion Type |
Width |
RoHS Status |
ROHS3 Compliant |
CYF0072V18L-133BGXI Overview
You will find FIFO memory chip in the 209-BGA package.You'll find it packaged in the shape of a Tray .Apps and data can be stored in the 72M 2M x 36 memory of the FIFO chip.Reliable operation requires a temperature of -40°C~85°C .The FIFO memory's mounting type is Surface Mount .This FIFO products operates at 1.7V~1.9V volts.
CYF0072V18L-133BGXI Features
72M 2M x 36 memory size
CYF0072V18L-133BGXI Applications
There are a lot of Rochester Electronics, LLC CYF0072V18L-133BGXI FIFOs Memory applications.
- Signal processing
- Networking
- SPI Bus Flash Memory Device
- MP3 Interface for Automobile
- Address mapping
- Code converters
- Game Consoles
- Programmable Logic Controller
- Video
- Extended product life cycle