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CYF0072V18L-133BGXI

FIFO memory IC72M 2M x 3610ns


  • Manufacturer: Rochester Electronics, LLC
  • Nocochips NO: 699-CYF0072V18L-133BGXI
  • Package: 209-BGA
  • Datasheet: PDF
  • Stock: 437
  • Description: FIFO memory IC72M 2M x 3610ns (Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 209-BGA
Supplier Device Package 209-FBGA (14x22)
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.7V~1.9V
Function Synchronous
Memory Size 72M 2M x 36
Access Time 10ns
Data Rate 133MHz
Bus Directional Uni-Directional
Retransmit Capability Yes
FWFT Support No
Programmable Flags Support Yes
Expansion Type Width
RoHS Status ROHS3 Compliant

CYF0072V18L-133BGXI Overview


You will find FIFO memory chip in the 209-BGA package.You'll find it packaged in the shape of a Tray .Apps and data can be stored in the 72M 2M x 36 memory of the FIFO chip.Reliable operation requires a temperature of -40°C~85°C .The FIFO memory's mounting type is Surface Mount .This FIFO products operates at 1.7V~1.9V volts.

CYF0072V18L-133BGXI Features


72M 2M x 36 memory size

CYF0072V18L-133BGXI Applications


There are a lot of Rochester Electronics, LLC CYF0072V18L-133BGXI FIFOs Memory applications.

  • Signal processing
  • Networking
  • SPI Bus Flash Memory Device
  • MP3 Interface for Automobile
  • Address mapping
  • Code converters
  • Game Consoles
  • Programmable Logic Controller
  • Video
  • Extended product life cycle

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