CYP15G0201DXB-BBI
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 196-LBGA |
| Supplier Device Package | 196-FBGA (15x15) |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Series | HOTlink II™ |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.135V~3.465V |
| Function | Transceiver |
| Interface | LVTTL |
| Number of Circuits | 2 |
| Current - Supply | 570mA |
| RoHS Status | Non-RoHS Compliant |
CYP15G0201DXB-BBI Overview
The 196-LBGA package reduces the amount of space on a board.To pack telecommunications equipment, the way of Tray is used.A Surface Mount-mount is used for mounting the telecom circuit.There are 2 circuits in this telecom IC .Improved efficiency can be ensured when the supply voltage of 3.135V~3.465V is provided.Reliable performance can be offered when the operating temperature is set at -40°C~85°C.The supply current is 570mA.With its similar functionality to electronic parts under the HOTlink II? series, it can perform a number of similar tasks.
CYP15G0201DXB-BBI Features
Available in the 196-LBGA package
CYP15G0201DXB-BBI Applications
There are a lot of Rochester Electronics, LLC CYP15G0201DXB-BBI Telecom applications.
- Intelligent PBX
- Interfaces to DS3
- Inverse Multiplexing for ATM (IMA)
- E2 Rates PCM Line Interface
- Fiber
- High-Density T1/E1/J1 interfaces for Multiplexers
- PDH Multiplexers
- Remote wireless modules
- E1 LAN/WAN Routers
- Home Gateway
