CYP15G0401DXB-BGI
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA Exposed Pad |
| Supplier Device Package | 256-BGA (27x27) |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Series | HOTlink II™ |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.135V~3.465V |
| Function | Transceiver |
| Interface | LVTTL |
| Number of Circuits | 4 |
| Current - Supply | 830mA |
| RoHS Status | Non-RoHS Compliant |
CYP15G0401DXB-BGI Overview
A 256-LBGA Exposed Pad package saves space on a board.Telecommunications equipment is packed according to Tray's method.The mounting type is Surface Mount.Telecommunications equipment consists of 4 circuits.Improved efficiency can be ensured when the supply voltage of 3.135V~3.465V is provided.-40°C~85°C is the operating temperature that can be set for reliable performance.Wit h a supply current of 830mA, telecom equipment operates.With its similar functionality to electronic parts under the HOTlink II? series, it can perform a number of similar tasks.
CYP15G0401DXB-BGI Features
Available in the 256-LBGA Exposed Pad package
CYP15G0401DXB-BGI Applications
There are a lot of Rochester Electronics, LLC CYP15G0401DXB-BGI Telecom applications.
- Digital subscriber line access multiplexer (DSLAM)
- T3 channelized access concentrators
- Public switching systems
- Fiber in the loop (FITL)
- Router
- Frame Relay Switches and Access Devices (FRADS)
- Integrated Access Devices
- Central office
- CSU/DSU E1 Interface
- M13 MUX
