Parameters | |
---|---|
Mounting Type | Surface Mount |
Package / Case | 256-LBGA Exposed Pad |
Surface Mount | YES |
Operating Temperature | 0°C~70°C |
Packaging | Tray |
Series | HOTlink II™ |
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 256 |
Terminal Finish | TIN LEAD |
Technology | BICMOS |
Voltage - Supply | 3.135V~3.465V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Supply Voltage | 3.3V |
Terminal Pitch | 1.27mm |
Reach Compliance Code | unknown |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | S-PBGA-B256 |
Function | Driver |
Qualification Status | COMMERCIAL |
Interface | LVTTL |
Number of Circuits | 4 |
Current - Supply | 590mA |
Telecom IC Type | TELECOM CIRCUIT |
Length | 27mm |
Width | 27mm |
RoHS Status | Non-RoHS Compliant |