Parameters |
Mounting Type |
Surface Mount |
Package / Case |
256-LBGA Exposed Pad |
Surface Mount |
YES |
Operating Temperature |
-40°C~85°C |
Packaging |
Tray |
Series |
HOTlink II™ |
JESD-609 Code |
e0 |
Pbfree Code |
no |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
Terminal Finish |
TIN LEAD |
Technology |
BICMOS |
Voltage - Supply |
3.135V~3.465V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
3.3V |
Terminal Pitch |
1.27mm |
Reach Compliance Code |
unknown |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B256 |
Function |
Driver |
Qualification Status |
COMMERCIAL |
Interface |
LVTTL |
Number of Circuits |
4 |
Current - Supply |
590mA |
Telecom IC Type |
TELECOM CIRCUIT |
Length |
27mm |
Width |
27mm |
RoHS Status |
Non-RoHS Compliant |
CYP15G0401TB-BGI Overview
A 256-LBGA Exposed Pad package saves space on a board.Telecommunications equipment is packed using the Tray method.A Surface Mount mounting type is used.A 4 circuit is the heart of this telecom IC .Wtelecom IC's efficiencyh a high supply voltage, 3.135V~3.465V can be operated more efficiently.The operating temperature set at -40°C~85°C can offer reliable performance.Telecom switching configuration contains 256 terminations.It operates with a voltage of 3.3V.It uses the TELECOM CIRCUIT IC type for its telecom IC.The current supply is 590mA.The HOTlink II? series is capable of providing a number of similar functions to the W series.
CYP15G0401TB-BGI Features
Available in the 256-LBGA Exposed Pad package
TELECOM CIRCUIT as telecom IC type
CYP15G0401TB-BGI Applications
There are a lot of Rochester Electronics, LLC CYP15G0401TB-BGI Telecom applications.
- Fiber Optic Terminals
- Multi-Line E1 Interface Cards
- Switching Systems
- Intelligent PBX
- Switches
- E2 Rates PCM Line Interface
- Fractional T1/E1/J1
- T1 Digital Cross Connects (DSX-1)
- E1 Multiplexer
- M13 MUX