Parameters | |
---|---|
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 256-LBGA Exposed Pad |
Number of Pins | 256 |
Operating Temperature | 0°C~70°C |
Packaging | Tray |
Published | 2005 |
Series | HOTlink II™ |
JESD-609 Code | e0 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 256 |
Terminal Finish | Tin/Lead (Sn/Pb) |
Subcategory | Network Interfaces |
Technology | BICMOS |
Voltage - Supply | 3.135V~3.465V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 225 |
Number of Functions | 1 |
Supply Voltage | 3.3V |
Terminal Pitch | 1.27mm |
Reach Compliance Code | unknown |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | CY*15G04 |
Pin Count | 256 |
Qualification Status | Not Qualified |
Operating Supply Voltage | 3.3V |
Interface | LVTTL |
Number of Circuits | 4 |
Nominal Supply Current | 1.06A |
Current - Supply | 830mA |
Data Rate | 1.5 Gbps |
Telecom IC Type | TELECOM CIRCUIT |
Number of Transceivers | 4 |
Length | 27mm |
Width | 27mm |
RoHS Status | Non-RoHS Compliant |