CYP15G0402DXB-BGXC

256 TerminationsTelecom device4 Circuits1 Functions

Manufacturer: Rochester Electronics, LLC
Nocochips NO: 699-CYP15G0402DXB-BGXC
Package: 256-LBGA Exposed Pad
Datasheet: PDF
Stock: 331
Description: 256 TerminationsTelecom device4 Circuits1 Functions(Kg)

Details

Tags

Parameters
Mounting Type	Surface Mount
Package / Case	256-LBGA Exposed Pad
Surface Mount	YES
Operating Temperature	0°C~70°C
Packaging	Tray
Series	HOTlink II™
JESD-609 Code	e1
Pbfree Code	yes
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	256
Terminal Finish	TIN SILVER COPPER
Technology	BICMOS
Voltage - Supply	3.135V~3.465V
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	260
Number of Functions	1
Supply Voltage	3.3V
Terminal Pitch	1.27mm
Reach Compliance Code	unknown
Time@Peak Reflow Temperature-Max (s)	20
Pin Count	256
JESD-30 Code	S-PBGA-B256
Qualification Status	COMMERCIAL
Interface	LVTTL
Number of Circuits	4
Current - Supply	830mA
Telecom IC Type	TELECOM CIRCUIT
Length	27mm
Width	27mm
RoHS Status	ROHS3 Compliant

CYP15G0402DXB-BGXC Overview

In order to save space on the board, 256-LBGA Exposed Pad packages are used.In order to pack telecommunications equipment, Tray is used.In this case, Surface Mount is the mounting type.4 circuits make up this telecom IC .Improved efficiency can be ensured when the supply voltage of 3.135V~3.465V is provided.0°C~70°C is a temperature setting that is reliable when telecom switching comes to performance.The configuration includes 256 terminations.With 3.3V as the supply voltage, it operates.It uses a TELECOM CIRCUIT type telecom IC.Telecom equipment operates wit h a supply current of 830mA.This part can perform many functions similar to the electronic parts under the HOTlink II? series.A 1 function is configured when designing.256 telecom products have pins designed specifically for their configuration.