Parameters |
Mounting Type |
Surface Mount |
Package / Case |
256-LBGA Exposed Pad |
Supplier Device Package |
256-BGA (27x27) |
Operating Temperature |
0°C~70°C |
Packaging |
Tray |
Series |
HOTlink II™ |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Voltage - Supply |
3.135V~3.465V |
Function |
Transceiver |
Interface |
LVTTL |
Number of Circuits |
4 |
Current - Supply |
900mA |
RoHS Status |
Non-RoHS Compliant |
CYP15G0403DXB-BGC Overview
In order to save space on the board, 256-LBGA Exposed Pad packages are used.Packing is done according to the Tray method.Mounting type Surface Mount is used.A 4 circuit is the heart of this telecom IC .3.135V~3.465V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.0°C~70°C is the operating temperature that can be set for reliable performance.Wit h a supply current of 900mA, telecom equipment operates.A lot of its functions of the telecommunication product are similar to those of the electronic parts in the HOTlink II? series.
CYP15G0403DXB-BGC Features
Available in the 256-LBGA Exposed Pad package
CYP15G0403DXB-BGC Applications
There are a lot of Rochester Electronics, LLC CYP15G0403DXB-BGC Telecom applications.
- Add/Drop multiplexers (ADMs)
- Short/Medium Loop
- Router
- Digital Cross-connect Systems (DCS)
- Fractional T1/E1/J1
- PCM Test Equipment
- E1 Multiplexer
- T1 Rates PCM Line Interface
- Home Side Box
- T2 Rates PCM Line Interface