Parameters | |
---|---|
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 196-LBGA |
Number of Pins | 196 |
Operating Temperature | 0°C~70°C |
Packaging | Tray |
Published | 2003 |
Series | HOTlink II™ |
JESD-609 Code | e1 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 5 (48 Hours) |
Number of Terminations | 196 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Subcategory | Network Interfaces |
Technology | BICMOS |
Voltage - Supply | 3.135V~3.465V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 3.3V |
Terminal Pitch | 1mm |
Reach Compliance Code | unknown |
Time@Peak Reflow Temperature-Max (s) | 20 |
Base Part Number | CY*15G02 |
Function | Transceiver |
Qualification Status | Not Qualified |
Operating Supply Voltage | 3.3V |
Interface | LVTTL |
Number of Circuits | 2 |
Nominal Supply Current | 700mA |
Current - Supply | 570mA |
Data Rate | 1500000 Mbps |
Number of Transceivers | 2 |
Height Seated (Max) | 1.5mm |
Length | 15mm |
Width | 15mm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |