CYV15G0402DXB-BGXC

256 TerminationsTelecom device4 Circuits1 Functions

Manufacturer: Rochester Electronics, LLC
Nocochips NO: 699-CYV15G0402DXB-BGXC
Package: 256-LBGA Exposed Pad
Datasheet: PDF
Stock: 767
Description: 256 TerminationsTelecom device4 Circuits1 Functions(Kg)

Details

Tags

Parameters
Mounting Type	Surface Mount
Package / Case	256-LBGA Exposed Pad
Surface Mount	YES
Operating Temperature	0°C~70°C
Packaging	Tray
Series	HOTlink II™
JESD-609 Code	e1
Pbfree Code	yes
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	256
Terminal Finish	TIN SILVER COPPER
Technology	BICMOS
Voltage - Supply	3.135V~3.465V
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	260
Number of Functions	1
Supply Voltage	3.3V
Terminal Pitch	1.27mm
Reach Compliance Code	unknown
Time@Peak Reflow Temperature-Max (s)	20
Pin Count	256
JESD-30 Code	S-PBGA-B256
Qualification Status	COMMERCIAL
Interface	LVTTL
Number of Circuits	4
Current - Supply	830mA
Telecom IC Type	TELECOM CIRCUIT
Length	27mm
Width	27mm
RoHS Status	ROHS3 Compliant

CYV15G0402DXB-BGXC Overview

In order to save space on the board, the 256-LBGA Exposed Pad package is used.To pack telecommunications equipment, the way of Tray is used.Mounting type Surface Mount is used.Telecommunications equipment consists of 4 circuits.The voltage supplied to 3.135V~3.465V can improve efficiency.A 0°C~70°C-temperature setting offers reliable performance.Configuration of this telecom circuit has 256 terminations.It operates with a voltage of 3.3V.TELECOM CIRCUIT is the type of IC it uses for telecom.Telecom equipment operates wit h a supply current of 830mA.There are many similar functions of the telecommunication product that it can provide with the electronic components under the HOTlink II? series.When designing, 1 functions are configured.There is a specific configuration for the pins on the 256 telecom product.