CYW15G0403DXB-BGC
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA Exposed Pad |
| Packaging | Tray |
| Published | 2012 |
| Series | HOTlink II™ |
| JESD-609 Code | e0 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Subcategory | Network Interfaces |
| Technology | BICMOS |
| Voltage - Supply | 3.135V~3.465V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 225 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 1.27mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | CY*15G04 |
| Pin Count | 256 |
| JESD-30 Code | S-PBGA-B256 |
| Qualification Status | Not Qualified |
| Power Supplies | 3.3V |
| Temperature Grade | COMMERCIAL |
| Number of Circuits | 4 |
| Nominal Supply Current | 1.27A |
| Data Rate | 1500000 Mbps |
| Telecom IC Type | TELECOM CIRCUIT |
| Number of Transceivers | 4 |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | Non-RoHS Compliant |
See Relate Datesheet
