CYW15G0403DXB-BGI
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA Exposed Pad |
| Surface Mount | YES |
| Packaging | Tray |
| Series | HOTlink II™ |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | TIN LEAD |
| Technology | BICMOS |
| Voltage - Supply | 3.135V~3.465V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 235 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 1.27mm |
| Reach Compliance Code | unknown |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 256 |
| JESD-30 Code | S-PBGA-B256 |
| Qualification Status | COMMERCIAL |
| Operating Temperature (Max) | 85°C |
| Temperature Grade | INDUSTRIAL |
| Number of Circuits | 4 |
| Telecom IC Type | TELECOM CIRCUIT |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | Non-RoHS Compliant |
CYW15G0403DXB-BGI Overview
A 256-LBGA Exposed Pad package is used to reduce board space requirements.In order to pack telecommunications equipment, Tray is used.A Surface Mount-mount is used for mounting the telecom circuit.Telecom circuit is made up of 4 circuits.3.135V~3.465V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.The configuration includes 256 terminations.The supply voltage it operates with is 3.3V.It adopts TELECOM CIRCUIT as its telecom IC type.With the HOTlink II? series electronic parts, it can perform similar functions of the telecommunication product .A 1 function is configured when designing.There is a specific configuration for the pins on the 256 telecom product.Telecommunication tools supports the maximum operating temperature of 85°C.
CYW15G0403DXB-BGI Features
Available in the 256-LBGA Exposed Pad package
TELECOM CIRCUIT as telecom IC type
CYW15G0403DXB-BGI Applications
There are a lot of Rochester Electronics, LLC CYW15G0403DXB-BGI Telecom applications.
- Switches
- Integrated Access Devices
- CSU/DSU E1/T1/J1 Interface
- Digital Modems
- T1 Rates PCM Line Interface
- SDH/SONET multiplexers
- Channel Banks
- T1/E1/J1 Multiplexer and Channel Banks
- Fiber In The Loop (FITL)
- Digital Cross Connect Systems
