Parameters | |
---|---|
Contact Plating | Gold |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | SIP |
Number of Pins | 8 |
Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
Number of Positions or Pins (Grid) | 8 (1 x 8) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Brass |
Operating Temperature | -55°C~125°C |
Packaging | Bulk |
Published | 2010 |
Series | D01-950 |
Feature | Elevated |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
Type | SIP |
Max Operating Temperature | 125°C |
Min Operating Temperature | -55°C |
Contact Finish - Mating | Gold |
Current Rating (Amps) | 1A |
Current Rating | 1A |
Pitch - Mating | 0.100 2.54mm |
Contact Finish - Post | Tin |
Lead Length | 3.2004mm |
Contact Resistance | 10mOhm |
Termination Post Length | 0.126 3.20mm |
Pitch - Post | 0.100 2.54mm |
Contact Finish Thickness - Mating | 29.5μin 0.75μm |
Material Flammability Rating | UL94 V-0 |
RoHS Status | ROHS3 Compliant |
Flammability Rating | UL94 V-0 |