Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Chassis Mount |
Package / Case | DO-200AC, K-PUK |
Surface Mount | YES |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 2009 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Number of Terminations | 2 |
ECCN Code | EAR99 |
HTS Code | 8541.10.00.80 |
Terminal Position | END |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | O-CEDB-N2 |
Operating Temperature (Max) | 160°C |
Number of Elements | 1 |
Configuration | SINGLE |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 100mA @ 4400V |
Voltage - Forward (Vf) (Max) @ If | 1.32V @ 1500A |
Operating Temperature - Junction | -40°C~160°C |
Output Current-Max | 1800A |
Application | GENERAL PURPOSE |
Halogen Free | Halogen Free |
Voltage - DC Reverse (Vr) (Max) | 4400V |
Current - Average Rectified (Io) | 1800A |
Number of Phases | 1 |
Max Repetitive Reverse Voltage (Vrrm) | 4.4kV |
Rep Pk Reverse Voltage-Max | 4400V |
Non-rep Pk Forward Current-Max | 27500A |
Max Forward Surge Current (Ifsm) | 27.5kA |
RoHS Status | Non-RoHS Compliant |
Lead Free | Lead Free |