Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | SOD-123F |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Cut Tape (CT) |
Published | 2014 |
JESD-609 Code | e6 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Finish | Tin/Bismuth (Sn/Bi) |
Max Operating Temperature | 125°C |
Min Operating Temperature | -55°C |
HTS Code | 8541.10.00.80 |
Terminal Position | DUAL |
Terminal Form | FLAT |
Base Part Number | DB2X207 |
Pin Count | 2 |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Schottky |
Current - Reverse Leakage @ Vr | 1.5mA @ 6V |
Voltage - Forward (Vf) (Max) @ If | 400mV @ 1A |
Forward Current | 1A |
Max Reverse Leakage Current | 1.5mA |
Operating Temperature - Junction | 125°C Max |
Max Surge Current | 7A |
Output Current-Max | 1A |
Max Reverse Voltage (DC) | 20V |
Average Rectified Current | 1A |
Reverse Recovery Time | 12 ns |
Peak Reverse Current | 1.5μA |
Max Repetitive Reverse Voltage (Vrrm) | 20V |
Capacitance @ Vr, F | 43pF @ 10V 1MHz |
Peak Non-Repetitive Surge Current | 7A |
Max Forward Surge Current (Ifsm) | 7A |
Recovery Time | 12 ns |
Height | 800μm |
Length | 2.6mm |
Width | 1.6mm |
Radiation Hardening | No |
RoHS Status | RoHS Compliant |