Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Chassis Mount |
Package / Case | Module |
Surface Mount | NO |
Diode Element Material | SILICON |
Packaging | Tray |
Published | 2002 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Number of Terminations | 4 |
ECCN Code | EAR99 |
HTS Code | 8541.10.00.80 |
Terminal Position | UPPER |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | not_compliant |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-XUFM-X4 |
Operating Temperature (Max) | 125°C |
Number of Elements | 2 |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 1500A @ 2800V |
Voltage - Forward (Vf) (Max) @ If | 3.1V @ 1200A |
Case Connection | ISOLATED |
Operating Temperature - Junction | -50°C~125°C |
Output Current-Max | 1200A |
Application | MEDIUM VOLTAGE HIGH POWER |
Voltage - DC Reverse (Vr) (Max) | 4500V |
Number of Phases | 1 |
Rep Pk Reverse Voltage-Max | 4500V |
Diode Configuration | 2 Independent |
RoHS Status | Non-RoHS Compliant |