Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Chassis Mount |
Package / Case | Module |
Surface Mount | NO |
Diode Element Material | SILICON |
Operating Temperature | 150°C TJ |
Packaging | Tray |
Published | 2012 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Additional Feature | HIGH RELIABILITY, UL RECOGNIZED |
HTS Code | 8541.10.00.80 |
Technology | Standard |
Terminal Position | UPPER |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-XUFM-X3 |
Number of Elements | 2 |
Configuration | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS |
Diode Type | Single Phase |
Current - Reverse Leakage @ Vr | 25mA @ 2200V |
Case Connection | ISOLATED |
Output Current-Max | 700A |
Application | MEDIUM POWER |
Halogen Free | Not Halogen Free |
Current - Average Rectified (Io) | 360A |
Number of Phases | 1 |
Max Repetitive Reverse Voltage (Vrrm) | 2.2kV |
Rep Pk Reverse Voltage-Max | 2200V |
Non-rep Pk Forward Current-Max | 19000A |
Forward Voltage-Max | 1.36V |
Reverse Current-Max | 40000μA |
Max Forward Surge Current (Ifsm) | 13kA |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |