Parameters | |
---|---|
Mounting Type | Chassis Mount |
Package / Case | Module |
Surface Mount | NO |
Diode Element Material | SILICON |
Packaging | Tray |
Published | 2002 |
Pbfree Code | no |
Part Status | Last Time Buy |
Moisture Sensitivity Level (MSL) | Not Applicable |
Number of Terminations | 4 |
ECCN Code | EAR99 |
HTS Code | 8541.10.00.80 |
Subcategory | Other Diodes |
Terminal Position | UPPER |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | not_compliant |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Pin Count | 4 |
JESD-30 Code | R-XUFM-X4 |
Qualification Status | Not Qualified |
Operating Temperature (Max) | 150°C |
Number of Elements | 2 |
Power Dissipation-Max | 800000W |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 550A @ 1800V |
Voltage - Forward (Vf) (Max) @ If | 3.5V @ 400A |
Case Connection | ISOLATED |
Operating Temperature - Junction | -40°C~125°C |
Output Current-Max | 400A |
Application | GENERAL PURPOSE |
Voltage - DC Reverse (Vr) (Max) | 3300V |
Number of Phases | 1 |
Rep Pk Reverse Voltage-Max | 3300V |
Diode Configuration | 2 Independent |
RoHS Status | Non-RoHS Compliant |