DD500S33HE3BPSA1
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Chassis Mount |
| Package / Case | Module |
| Surface Mount | NO |
| Diode Element Material | SILICON |
| Packaging | Tray |
| Published | 2016 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Number of Terminations | 4 |
| ECCN Code | EAR99 |
| HTS Code | 8541.10.00.80 |
| Terminal Position | UPPER |
| Terminal Form | UNSPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Reach Compliance Code | compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PUFM-X4 |
| Operating Temperature (Max) | 150°C |
| Number of Elements | 2 |
| Speed | Standard Recovery >500ns, > 200mA (Io) |
| Diode Type | Standard |
| Current - Reverse Leakage @ Vr | 500A @ 1800V |
| Voltage - Forward (Vf) (Max) @ If | 3.85V @ 500A |
| Case Connection | ISOLATED |
| Operating Temperature - Junction | -40°C~150°C |
| Output Current-Max | 500A |
| Application | GENERAL PURPOSE |
| Voltage - DC Reverse (Vr) (Max) | 3300V |
| Number of Phases | 1 |
| Rep Pk Reverse Voltage-Max | 3300V |
| Diode Configuration | 2 Independent |
| RoHS Status | RoHS Compliant |
See Relate Datesheet
