Parameters | |
---|---|
Mounting Type | Chassis Mount |
Package / Case | Module |
Surface Mount | NO |
Diode Element Material | SILICON |
Packaging | Tray |
Published | 1999 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
Terminal Position | UPPER |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-XUFM-X6 |
Operating Temperature (Max) | 150°C |
Number of Elements | 6 |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 5mA @ 1600V |
Voltage - Forward (Vf) (Max) @ If | 1.44V @ 100A |
Case Connection | ISOLATED |
Forward Current | 100A |
Operating Temperature - Junction | 150°C Max |
Output Current-Max | 104A |
Halogen Free | Not Halogen Free |
Voltage - DC Reverse (Vr) (Max) | 1600V |
Current - Average Rectified (Io) | 60A |
Number of Phases | 3 |
Max Repetitive Reverse Voltage (Vrrm) | 1.6kV |
Rep Pk Reverse Voltage-Max | 1600V |
Diode Configuration | 3 Independent |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |