Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 1 day ago) |
Contact Plating | Tin |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | 4-SIP, TS-6P |
Weight | 7g |
Operating Temperature | -55°C~150°C TJ |
Packaging | Bulk |
Published | 2016 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
HTS Code | 8541.10.00.80 |
Technology | Standard |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | not_compliant |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Element Configuration | Single |
Diode Type | Single Phase |
Current - Reverse Leakage @ Vr | 10μA @ 1000V |
Voltage - Forward (Vf) (Max) @ If | 1.1V @ 20A |
Forward Current | 20A |
Peak Reverse Current | 10μA |
Max Repetitive Reverse Voltage (Vrrm) | 1kV |
Max Forward Surge Current (Ifsm) | 250A |
RoHS Status | ROHS3 Compliant |