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DILB18P-223TLF

Socket;DIP;Dual;18Pos;2.54mmPitch;ThruHole;CopperCnt;TinPlating


  • Manufacturer: Amphenol ICC (FCI)
  • Nocochips NO: 44-DILB18P-223TLF
  • Package: DIP
  • Datasheet: -
  • Stock: 834
  • Description: Socket;DIP;Dual;18Pos;2.54mmPitch;ThruHole;CopperCnt;TinPlating (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Material Bronze
Contact Plating Tin
Mount Through Hole
Mounting Type Through Hole
Package / Case DIP
Insulation Material Polyester
Housing Material Polyamide (PA), Nylon
Number of Positions or Pins (Grid) 18 (2 x 9)
Contact Material - Mating Copper Alloy
Contact Material - Post Copper Alloy
Operating Temperature -55°C~125°C
Packaging Tube
Series DILB
Feature Open Frame
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type DIP, Socket
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Positions 18
Max Operating Temperature 105°C
Min Operating Temperature -55°C
Number of Rows 2
Voltage - Rated 200V
Contact Finish - Mating Tin-Lead
Current Rating (Amps) 1A
Pitch 2.54mm
Orientation Straight
Depth 10.16mm
Current Rating 1A
Pitch - Mating 0.100 2.54mm
Voltage - Rated AC 200V
Number of Contacts 18
Contact Finish - Post Tin-Lead
Contact Resistance 30mOhm
Insulation Resistance 500MOhm
Row Spacing 7.62 mm
Termination Post Length 0.124 3.15mm
Pitch - Post 0.100 2.54mm
Length 22.86mm
Width 10.16mm
Contact Finish Thickness - Mating 100.0μin 2.54μm
Contact Finish Thickness - Post 100.0μin 2.54μm
Material Flammability Rating UL94 V-0
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
See Relate Datesheet

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