DL4448-TP
| Parameters | |
|---|---|
| JESD-30 Code | O-LELF-R2 |
| Qualification Status | Not Qualified |
| Operating Temperature (Max) | 200°C |
| Number of Elements | 1 |
| Configuration | SINGLE |
| Power Dissipation-Max | 0.5W |
| Speed | Small Signal =< 200mA (Io), Any Speed |
| Diode Type | Standard |
| Current - Reverse Leakage @ Vr | 5μA @ 75V |
| Voltage - Forward (Vf) (Max) @ If | 1V @ 100mA |
| Case Connection | ISOLATED |
| Operating Temperature - Junction | 200°C Max |
| Output Current-Max | 0.15A |
| Voltage - DC Reverse (Vr) (Max) | 75V |
| Current - Average Rectified (Io) | 150mA |
| Reverse Recovery Time | 4ns |
| Rep Pk Reverse Voltage-Max | 75V |
| RoHS Status | RoHS Compliant |
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | DO-213AC, MINI-MELF, SOD-80 |
| Surface Mount | YES |
| Diode Element Material | SILICON |
| Packaging | Tape & Reel (TR) |
| Published | 2003 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| Additional Feature | METALLURGICAL BONDED |
| HTS Code | 8541.10.00.70 |
| Terminal Position | END |
| Terminal Form | WRAP AROUND |
| Peak Reflow Temperature (Cel) | 260 |
| Reach Compliance Code | compliant |
| Time@Peak Reflow Temperature-Max (s) | 10 |
| Base Part Number | DL4448 |
| Pin Count | 2 |
See Relate Datesheet
