Parameters | |
---|---|
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 200mW |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 4 Ω @ 100mA, 4V |
Vgs(th) (Max) @ Id | 1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 25pF @ 10V |
Current - Continuous Drain (Id) @ 25°C | 160mA Ta |
Drive Voltage (Max Rds On,Min Rds On) | 2.5V 4V |
Vgs (Max) | ±12V |
Continuous Drain Current (ID) | 160mA |
Threshold Voltage | 800mV |
Gate to Source Voltage (Vgs) | 12V |
Drain-source On Resistance-Max | 4Ohm |
Drain to Source Breakdown Voltage | 50V |
Height | 750μm |
Length | 1.6mm |
Width | 800μm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | SOT-523 |
Number of Pins | 3 |
Weight | 7.994566mg |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2012 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) |
Additional Feature | HIGH RELIABILITY |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Pin Count | 3 |
Number of Elements | 1 |
Number of Channels | 1 |
Power Dissipation-Max | 200mW Ta |
Element Configuration | Single |