Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 9-UFBGA, WLBGA |
Number of Pins | 9 |
Operating Temperature | -55°C~150°C TJ |
Packaging | Cut Tape (CT) |
Published | 2012 |
JESD-609 Code | e1 |
Part Status | Discontinued |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Subcategory | Other Transistors |
Technology | MOSFET (Metal Oxide) |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Configuration | Single |
Number of Channels | 1 |
Power Dissipation-Max | 1W Ta |
Turn On Delay Time | 8.5 ns |
FET Type | P-Channel |
Rds On (Max) @ Id, Vgs | 33m Ω @ 2A, 4.5V |
Vgs(th) (Max) @ Id | 1.1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 500pF @ 10V |
Current - Continuous Drain (Id) @ 25°C | 4.2A Ta |
Gate Charge (Qg) (Max) @ Vgs | 7nC @ 4.5V |
Rise Time | 11.8ns |
Drain to Source Voltage (Vdss) | 20V |
Drive Voltage (Max Rds On,Min Rds On) | 1.8V 4.5V |
Fall Time (Typ) | 56 ns |
Turn-Off Delay Time | 47 ns |
Continuous Drain Current (ID) | 4.2A |
Gate to Source Voltage (Vgs) | -6V |
Drain Current-Max (Abs) (ID) | 5.8A |
Drain to Source Breakdown Voltage | -20V |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |