Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Gold |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 3-XFDFN |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2012 |
JESD-609 Code | e4 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Resistance | 970mOhm |
Additional Feature | HIGH RELIABILITY |
Subcategory | Other Transistors |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Number of Elements | 1 |
Number of Channels | 1 |
Power Dissipation-Max | 460mW Ta |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 950mW |
Turn On Delay Time | 8.5 ns |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 970m Ω @ 100mA, 5V |
Vgs(th) (Max) @ Id | 1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 46.1pF @ 10V |
Current - Continuous Drain (Id) @ 25°C | 700mA Ta |
Gate Charge (Qg) (Max) @ Vgs | 500nC @ 4.5V |
Rise Time | 4.3ns |
Drain to Source Voltage (Vdss) | 20V |
Drive Voltage (Max Rds On,Min Rds On) | 1.2V 5V |
Vgs (Max) | ±8V |
Fall Time (Typ) | 19.2 ns |
Turn-Off Delay Time | 20.2 ns |
Continuous Drain Current (ID) | 700mA |
Gate to Source Voltage (Vgs) | 8V |
Drain Current-Max (Abs) (ID) | 0.5A |
DS Breakdown Voltage-Min | 20V |
Height | 350μm |
Length | 1.05mm |
Width | 650μm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |