Parameters | |
---|---|
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Power Dissipation-Max | 600mW Ta |
FET Type | P-Channel |
Rds On (Max) @ Id, Vgs | 14 Ω @ 200mA, 10V |
Vgs(th) (Max) @ Id | 2.5V @ 1mA |
Input Capacitance (Ciss) (Max) @ Vds | 81pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 260mA Ta |
Gate Charge (Qg) (Max) @ Vgs | 2.8nC @ 10V |
Drain to Source Voltage (Vdss) | 250V |
Drive Voltage (Max Rds On,Min Rds On) | 3.5V 10V |
Vgs (Max) | ±40V |
Continuous Drain Current (ID) | 260mA |
RoHS Status | ROHS3 Compliant |
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 6-UDFN Exposed Pad |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2004 |
JESD-609 Code | e4 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
Technology | MOSFET (Metal Oxide) |