Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 3-XFDFN |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2014 |
JESD-609 Code | e4 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Number of Elements | 1 |
Number of Channels | 1 |
Power Dissipation-Max | 390mW Ta |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Case Connection | DRAIN |
Turn On Delay Time | 3.1 ns |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 5 Ω @ 100mA, 4.5V |
Vgs(th) (Max) @ Id | 1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 22.5pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 200mA Ta |
Gate Charge (Qg) (Max) @ Vgs | 0.35nC @ 4.5V |
Rise Time | 2.3ns |
Drain to Source Voltage (Vdss) | 30V |
Drive Voltage (Max Rds On,Min Rds On) | 1.2V 10V |
Vgs (Max) | ±10V |
Fall Time (Typ) | 10.5 ns |
Turn-Off Delay Time | 19.9 ns |
Continuous Drain Current (ID) | 200mA |
Gate to Source Voltage (Vgs) | 10V |
Drain Current-Max (Abs) (ID) | 0.2A |
Drain-source On Resistance-Max | 5Ohm |
Drain to Source Breakdown Voltage | -30V |
RoHS Status | ROHS3 Compliant |